Application: for polishing of semiconductor materials (silicon, sapphire, germanium ets.) used in the manufacture of integrated circuits.
Advantages: high stability of the suspension without separation; high performance (removal rate) polishing process; high surface quality.
Key features:
Basis: oil (O); water (B).
Grit diamond micropowder -1/0; 2/1; 3/2; 5/3; 7/5; 10/7 mm.
The concentration of diamond micropowder slurry 1-50 wt. %.
Developed: Research Laboratory of Highway Engineering and Operation, Supervisor – Dr. Svetlana Yakubovskaya, PhD.
Tel.: +375 17 292 74 83, e-mail: nil_sed@bntu.by.